Molex C-Grid III Interconnection System Connector HousingsThis range of Connector Housings feature a 2.54 mm pitch and form part of the C-Grid III interconnection system from Molex. This system offers post and receptacle interconnection, with design flexibility and modular components that provide a wide range of interconnection packaging alternatives within the electronic markets. Ideal for use with a wide range of commercial and consumer applications.Features and Benefits• 2.54 mm pitch• 1 to 80 Circuits• Dual and single row housing• Black in colour• Wire to board configurations and fittings• Uniform locking system in place on all contacts• Interchangeable housing stylesStandardsDIN 41651, HE13/142.54mm Molex C-Grid III Range