TGP 1000VOUS Ultra Conformable GAP PAD® Bergquist TGP 1000VOUS Ultra Conformable GAP PAD® filling material provides ultra-conformable gel-like material with thermal conductivity of 1.0W/m-K. This filling material is ultra-soft and offers excellent low-stress vibration dampening and shock absorbency for applications requiring a minimum amount of pressure on components. Bergquist GAP PAD TGP 1000VOUS Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.