2010 Format CRCW Series - 1% (Paper T/R) (10Ω to 100kΩ)Metal glaze on high quality ceramicProtective over glazeExcellent stability (ΔR/R ≤ 1 % for 1000h at 70 °C)Lead (Pb)-free solder contacts on Ni barrier layerPure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes