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    1 pcs : FGM230SB27HGN3 - Sub-GHz Modules Proprietory, Secure Vault High, +14 dBm, Sub-GHz, 512 kB , -40 to 85 C, RF Pin
    • 1 pcs : FGM230SB27HGN3 - Sub-GHz Modules Proprietory, Secure Vault High, +14 dBm, Sub-GHz, 512 kB , -40 to 85 C, RF Pin

    1 pcs : FGM230SB27HGN3 - Sub-GHz Modules Proprietory, Secure Vault High, +14 dBm, Sub-GHz, 512 kB , -40 to 85 C, RF Pin

    electronicparts-UK/M/634-FGM230SB27HGN3
    £25.79
    Delivery: 7-10 business days
    Quantity
    10 Items

    Description
    FGM230 SiP Module Silicon Labs FGM230 SiP Module can develop sub-GHz IoT wireless connectivity for smart homes, security, lighting, building automation, and metering. The high-performance sub-GHz radio provides a long range. The Silicon Labs FGM230 board is not susceptible to 2.4GHz interference from technologies. The single-die, multi-core solution provides industry-leading security, low power consumption, and fast wake-up times. An integrated power amplifier enables the next generation of secure connectivity for IoT devices.
    Product Details
    SILICON LABS
    electronicparts-UK/M/634-FGM230SB27HGN3
    FGM230SB27HGN3
    10 Items

    Data sheet

    Manufacturer
    Silicon Laboratories
    Dimensions
    6.5 mm x 6.5 mm
    Output power
    14 dBm
    Frequency
    868 MHz, 915 MHz
    Series
    FGM230S
    Maximum Operating Temperature
    + 85 C
    Minimum Operating Temperature
    - 40 C
    Mounting Style
    SMD/SMT
    Type
    Proprietary SiP Module
    Product Type
    Sub-GHz Modules
    Interface Type
    I2C, USART
    Product Category
    Sub-GHz Modules
    Packaging
    Tray
    RoHS
    Details
    Supply Voltage - Min
    1.8 V
    Supply Voltage - Max
    3.8 V
    Brand
    Silicon Labs
    Moisture Sensitive
    Yes
    Factory Pack Quantity Factory Pack Quantity
    1300
    Subcategory
    Wireless & RF Modules
    Supply Current Receiving
    7.5 mA
    Supply Current Transmitting
    46.8 mA
    Antenna Connector Type
    Pin
    Protocol - Sub GHz
    Sub GHz