KC-LINK™ Capacitors with KONNEKT™ Technology KEMET KC-LINK™ Capacitors with KONNEKT™ Technology are surface-mount capacitors designed for high-efficiency and high-density power applications. KONNEKT high-density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface-mount multichip solution for high-density packaging. By utilizing KEMET's robust and proprietary C0G Base Metal Electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.