100 pcs - 77311-101-03LF Amphenol Communications Solutions Bergstik Series Through Hole Pin Header, 3 Contact(s), 2.54mm Pitch,

The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.High temperature thermoplastic material Reflow compatibleVariable spacing height for stacking headers Cater to a wide range of applicationsAllow dual entry, mating from top or bottom Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements