1 pcs : HDTM-3-04-1-S-VT-0-1 - High Speed/Modular Connectors XCede HD 1.80 mm High-Density Backplane Vertical Header

XCede® HD High-Density Backplane Systems Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options.