Syfer Flexicap 0805FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes0805 RangeNickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the 'temperature compensating', EIA Class I ceramic materials, X7R, X5R formulations are called 'temperature stable' ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials, these characteristics are ideal for decoupling applications.