Syfer Flexicap 1206FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes1206 RangeC0G (NP0) is the most popular formulation of the 'temperature-compensating', EIA Class I ceramic materialsX7R formulations are called 'temperature stable' ceramics and fall into EIA Class II materialsY5V formulations are for general-purpose use in a limited temperature range.These characteristics make Y5V ideal for decoupling applications