BGA Chipset Heat SinksHigh-performance precision-forged clip-attachment heatsinks for BGA chipsets.AL6063 grade aluminium at 201 W/m K thermal conductivityAvailable in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performanceAttachment by plastic clipExcellent performance for both natural convection and low to medium airflow levels with low pressure dropBGA Heatsinks