10 pcs - ICK BGA 10x10x10 Heatsink, Universal Square Alu, 28.5K/W, 10 x 10 x 10mm, Adhesive Foil, Conductive Foil

Fischer Elektronik ICK BGA Series HeatsinkICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).Features and BenefitsBlack anodised surface.Heatsink dimensions match respective BGA-type.Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).BGA Heatsinks