The Vishay THJP surface mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminium nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available.Electrically isolated thermal conductorHigh thermal conductivity AlN substrate (170 W/mK)Electrically isolated terminations (>, 999 MΩ)Low capacitanceAvailable with SnPb or lead (Pb)-free wrap terminations