1 pcs : ATS-1040-C3-R0 - Heat Sinks The factory is currently not accepting orders for this product.

maxiFLOW™ Heatsinks Advanced Thermal Solutions (ATS) maxiFLOW™ Heatsinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heatsink designs. The maxiFLOW™ heatsinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heatsink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heatsink.