1 pcs : ATS-59007-C1-R0 - Heat Sinks The factory is currently not accepting orders for this product.
    • 1 pcs : ATS-59007-C1-R0 - Heat Sinks The factory is currently not accepting orders for this product.

    1 pcs : ATS-59007-C1-R0 - Heat Sinks The factory is currently not accepting orders for this product.

    Allparts-UK/M/984-ATS-59007-C1-R0
    £49.90
    Delivery: 7-10 business days
    Quantity
    10 Items

    Description
    BGA High-Performance Heat Sinks for NXP Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.
    Product Details
    Allparts-UK/M/984-ATS-59007-C1-R0
    ATS-59007-C1-R0
    10 Items

    Data sheet

    Manufacturer
    Advanced Thermal Solutions
    Width
    35 mm
    Height
    16 mm
    Length
    46 mm
    Series
    Device Specific
    Type
    Component
    Product Type
    Heat Sinks
    Product Category
    Heat Sinks
    Color
    Black
    RoHS
    Details
    Brand
    Advanced Thermal Solutions
    Product
    Heat Sink Assemblies
    Factory Pack Quantity Factory Pack Quantity
    100
    Subcategory
    Heat Sinks