1 pcs : 904-27-2-12-2-B-0 - Heat Sinks Chipset Heat Sink with Clip, Pin Fin, 27mm Chip Size, 11.6mm Height, Aluminum

900 Series Elliptical Fin Heat Sinks Wakefield-Vette 900 Series Elliptical Fin Heat Sinks are designed for airflow applications, including telecom, data centers, networking, cloud computing, and other industries. The heat sinks are constructed of AL 6063 material with a black anodized finish. The Wakefield-Vette 900 Series Elliptical Fin Heat Sinks are RoHS compliant and compatible with devices from a wide range of suppliers, including Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and more.