1 pcs : HSB38-707025P - Heat Sinks heat sink, BGA, 70 x 70 x 25 mm, 2 push pins

BGA Heat Sinks CUI Devices BGA Heat Sinks are ideal for ball grid array (BGA) devices and are measured under four conditions for thermal resistance. These heat sinks carry power dissipation ratings from 1.92W up to 21.74W at +75°C. Made from aluminum or copper with a black anodized or clean finish, the HSB series supports a wide range of sizes, from 8.5mm x 8.5mm to 69.7mm x 69.7mm, with 5mm to 25mm profiles. As adhesive or PCB mountable devices, CUI Devices BGA Heat Sinks are essentially simple extrusions where the extruded fins have been crosscut into pins, making them suitable for BGA applications.