maxiGRIP™ clipKIT™ Heat Sink Attachments Advanced Thermal Solutions maxiGRIP™ clipKIT™ Heat Sink Attachments feature a two-component system that quickly and securely mounts heat sinks to a range of hot-running Ball Grid Array (BGA) components. These attachments use a minimal amount of space on a PCB, eliminate the need to drill holes and allow the heat sink to be detached and reattached without damaging the component or PCB in the event the PCB needs to be reworked.